FilmTek™ spectrophotometry-based metrology systems from Scientific Computing International (SCI) have long set the standards for thin film measurement. Now — their FilmTek™ 4000 Series "raises the bar" by delivering 100 times the resolution of the best non-contact method for thin film measurement, and 10 times the resolution of the best prism coupler contact systems. It's the result of their patented DPSD™ (Differential Power Spectral Density) technique. And it's the latest example of how SCI is leading the thin film measurement field by raising performance to a new level — while offering systems that are truly affordable for virtually every application.
FilmTek™ metrology systems come in a variety of configurations, and depending on the model can measure reflection, reflection and transmission, multiple angle reflection, spectroscopic ellipsometry, and generalized ellipsometry data. FilmTek™ systems provide peak performance for thin film measurement from very-thin to very-thick films (up to 250 microns). It's achieved by high wavelength resolution detectors combined with low cone angle optical design and apertures to limit measurement spot size. Depending on the films involved, FilmTek™ systems can characterize up to fifteen layers, including film thickness, refractive index, and extinction coefficient. And they all offer a wavelength measurement range from 190 to 1700 nm using our proprietary dispersion model.
SCI offer complete, turn-key systems which are designed for simple, efficient, trouble-free push-button operation. The powerful software was designed to put measurements and answers just a click away. To help characterize and control deposition processes, it includes such capabilities as 2D and 3D contour and surface graphic plotting, a customizable database interface, and the ability to be controlled by a host computer. Versatile, flexible, reliable standard and custom FilmTek™ systems are available in a variety of configurations — from manual table top models, to fully automated systems with robotic cassette transfer and pattern recognition. All are designed for optimum accuracy and repeatability. They're easy to calibrate and operate. Along with features such as their unique optical design with no moving parts, they deliver long-lasting, reliable, trouble-free performance.
A variety of configurations are offered in the standard FilmTek™spectroscopic ellipsometer, reflectometer, and multiple angle reflectometer family. SCI also develops customized models to meet special needs. And they're all priced to fit most budgets.
Please contact us if you require further information on any of the FilmTek™ models below or custom requirements.
Please click on the links below to take you to individual products on SCI's website. There you will find a wealth of information on each systems capabilities.
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FilmTek™ 2000 / 2000M / 2000 PAR models augment those thin film measurement capabilities to encompass surface roughness and reflection at normal incidence from deep UV to NIR. Options include optics for small spot size measurements based on a microscope design (FilmTek™ 2000M) or parabolic mirrors (FilmTek™ 2000 PAR).
FilmTek™ 3000 / 3000M / 3000 PAR measures transmission and reflection of films deposited on transparent substrates. These thin film measurement systems are ideally suited for measuring the thickness and optical constants of very thin absorbing films. The FilmTek™ 3000M has a small spot size (40 µm) and can be equipped with a large custom stage for flat panel display applications.
FilmTek™ 2000SE / 3000SE is a high performance spectroscopic ellipsometer that measures from the deep UV to NIR. Based on a rotating compensator design, the FilmTek™ 2000SE spectroscopic ellipsometer combines spectroscopic ellipsometry with normal incidence DUV reflectometry to make it ideally suited for measuring the film thickness and optical constants of very thin films. The FilmTek™ 3000SE spectroscopic ellipsometer adds transmission measurement capability in addition to spectroscopic ellipsometry and multiple angle reflectometry. The FilmTek™ 2000SE spectroscopic ellipsometer utilizes SCI's material modeling software to provide an affordable and reliable thin film measurement tool for the simultaneous measurement of film thickness, refractive index, and extinction coefficient.
FilmTek™ 2000M TSV provides fast, accurate, and repeatable high-throughput TSV depth measurements necessary to ensure high yield during TSV fabrication. FilmTekTM 2000M TSV can readily determine etch depth for via structures with diameters greater than 1 µm up to a maximum etch depth of 500 µm. The FilmTekTM 2000M TSV can also be used for the measurement of height or depth, critical dimension (CD), and film thickness for MEMS, microbumps, trenches, and a variety of other structures and applications.
FilmTek™ 4000 is our most advanced model for thick film measurement applications. It incorporates multiple detectors positioned at different angles of incidence — plus our patented multi-angle Differential Power Spectral Density analysis capability — to accurately measure the index of refraction with a resolution of 0.00002. That's 100 times the performance of the best non-contact method, 10 times that of the best prism coupler contact systems. The FilmTek™ 4000 can measure birefringence of anisotropic materials. With its hot plate option, it can characterize the index of refraction and thermal expansion of a film as a function of temperature. And its spectroscopic ellipsometer option allows measurement of very thin films. A prime application for this system is measuring the index of refraction and thickness of planar waveguide films.
FilmTek™ CD is a cost effective solution for non-destructive optical CD metrology applications, accurately and simultaneously determining period, line width, trench depth, and sidewall angle. Based on technology combining multiple-angle polarized spectroscopic reflection and generalized spectroscopic ellipsometry, FilmTek™ CD measures Psi (y, ysp, yps), Delta (D, Dsp, Dps), Rs, Rp, Rsp, and Rps at 0 and 70 degrees to provide highly accurate measurements of profile information and film-thickness with a single tool. FilmTek™ CD can also be used to characterize biaxial (anisotropic) materials.
FilmTek™ 4000EM-DUV is our most advanced thin-film metrology system. It leverages the combination of new proprietary Multi-Angle Differential Polarimetry technology with SCI's patented Differential Power Spectral Density technology to provide an optical thin film metrology tool with the best resolution, accuracy, and repeatability in the industry. The FilmTek™ 4000EM-DUV utilizes spectroscopic reflection (190nm-1700nm) of polarized light at multiple angles to independently measure film thickness and refractive index. By independently measuring refractive index and film thickness, the FilmTek™ 4000EM-DUV is far more sensitive to changes in films, particularly films within multi-layer stacks, than existing metrology tools that rely on conventional ellipsometry or reflectometry techniques. Additionally, the FilmTek™ 4000EM-DUV has a small measurement spot size to allow for measurement directly on product wafers (measures within a 50x50 micron feature). Optional generalized ellipsometry is available for anisotropy and optical CD measurement.